PHIX announces collaboration with Lightmatter to enable scalable photonic integration

Under this collaboration, PHIX performs precision fiber array attachment processes for Lightmatter’s cutting-edge photonic chips, ensuring optimal optical connectivity, reliability, and scalability. Leveraging its expertise in photonic packaging and automated assembly, PHIX as a Lightmatter New Product Integration partner, is utilizing its manufacturing facilities at Kennispark in Enschede, the Netherlands, and Bozeman, Montana, USA. This supports Lightmatter’s mission to deliver breakthrough photonic technologies for AI and high-performance computing.

“We are excited to work with Lightmatter on this transformative technology,” says Jeroen Duis, Chief Technology Officer at PHIX. “Our advanced packaging capabilities and scalable manufacturing processes will help accelerate the deployment of photonic interconnect and computing solutions that set new standards in performance and energy efficiency.”

“The massive scale of next-generation AI workloads demands a fundamental shift toward Co-Packaged Optics (CPO),” said Sandeep Sane, Senior Director, Head of Photonics Packaging and Engineering at Lightmatter. “For years, PHIX has brought world-class expertise in developing assembly processes for various fiber attach methods, to our development collaboration, ensuring our technology delivers the performance and reliability customers expect.”

This collaboration underscores PHIX’s commitment to enabling the photonics industry with high-quality, scalable packaging solutions, while supporting innovative companies like Lightmatter in bringing disruptive technologies to market.